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Summary
Summary
| Description |
Template:De English: Cut through an SDRAM-Module. It is a multi-layer Printed Circuit Board (PCB) with BGA-packaging. On the right side a via. Template:Fr Template:Pl |
|---|---|
| Source |
Own work |
| Date |
2008-04-16 |
| Author | |
| Permission (Reusing this file) |
See below.
|
Licensing
 | Permission is granted to copy, distribute and/or modify this document under the terms of the GNU Free Documentation License, Version 1.2 or any later version published by the Free Software Foundation; with no Invariant Sections, no Front-Cover Texts, and no Back-Cover Texts. |
   | If this file is eligible for relicensing, it may also be used under the Creative Commons Attribution-ShareAlike 3.0 license. The relicensing status of this image has not yet been reviewed. You can help. |  |
File history
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| Date/Time | Thumbnail | Dimensions | User | Comment | |
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| current | 09:02, 16 November 2023 | | 1,024 × 631 (256 KB) | Isidore (talk | contribs) | == {{int:filedesc}} == {{Information |Description= {{de|Schnitt durch ein SDRAM-Modul/-Riegel. Es handelt sich um eine Multilayer-Platine mit aufgelötetem IC in BGA-Technik. Rechts eine Durchkontaktierung (Via). Aufnahme mit Pentax *ist Ds, daran adaptiert ein Minolta Rokkor MC 1.8/35mm HH in Retrostellung an einem Novoflex-Balgengerät. Blende 11, 1/160s, Beleuchtung mit [[:de:Mecablitz|Me... |
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